Substitutional doping strategies for fermi level depinning and enhanced interface quality in WS2-metal contacts

Show simple item record

dc.contributor.author Ghaffar, Abdul
dc.contributor.author Mohapatra, Nihar Ranjan
dc.contributor.author Maezono, Ryo
dc.contributor.author Hongo, Kenta
dc.coverage.spatial United States of America
dc.date.accessioned 2024-06-05T15:07:23Z
dc.date.available 2024-06-05T15:07:23Z
dc.date.issued 2024-05
dc.identifier.citation Ghaffar, Abdul; Mohapatra, Nihar Ranjan; Maezono, Ryo and Hongo, Kenta, "Substitutional doping strategies for fermi level depinning and enhanced interface quality in WS2-metal contacts", ACS Applied Electronic Materials, DOI: 10.1021/acsaelm.4c00609, May 2024.
dc.identifier.issn 2637-6113
dc.identifier.uri https://doi.org/10.1021/acsaelm.4c00609
dc.identifier.uri https://repository.iitgn.ac.in/handle/123456789/10111
dc.description.abstract Addressing contact resistance challenges at the interface between metals and transition-metal dichalcogenides (TMDs) remains a complex task due to the persistent Fermi level pinning (FLP) effect near the conduction band minima. Various methods have been explored to mitigate FLP by reducing the chemical interaction between metals and semiconductors. However, these approaches often lead to undesirable consequences, such as reduced adhesion and increased tunneling resistance, ultimately resulting in poor interface quality. A promising solution to overcome these limitations lies in the use of substitutionally doped semiconductor/metal interfaces. We conducted a thorough investigation using first-principles calculations, focusing on S-substituted WS2-metal interfaces involving commonly used metals such as Ag, Au, Cu, Pd, Pt, Sc, and Ti. Additionally, we explored the incorporation of nonmetallic dopants, including C, Cl, N, F, O, and P, into the WS2 surface. Our analysis revolved around several critical parameters, including adhesion strength, Schottky barrier height (SBH), tunnel barrier, charge transfer across the interface, and interface dipole formation. Our study demonstrated that substitutionally doped interfaces can undergo Fermi level depinning while maintaining an enhanced adhesion strength and lower tunneling barrier at the interface. This finding marks a departure from existing methods and offers a promising avenue for inducing p-type contact polarity and addressing contact resistance challenges in TMDs.
dc.description.statementofresponsibility by Abdul Ghaffar, Nihar Ranjan Mohapatra, Ryo Maezono and Kenta Hongo
dc.language.iso en_US
dc.publisher American Chemical Society
dc.subject Substitutionally doped WS2/metal contacts
dc.subject Nonmetallic dopants
dc.subject Fermi level depinning (FLDP)
dc.subject p-type Schottky barrier
dc.subject Metal-induced gap states (MIGS)
dc.title Substitutional doping strategies for fermi level depinning and enhanced interface quality in WS2-metal contacts
dc.type Article
dc.relation.journal ACS Applied Electronic Materials


Files in this item

Files Size Format View

There are no files associated with this item.

This item appears in the following Collection(s)

Show simple item record

Search Digital Repository


Browse

My Account