dc.contributor.author |
Kumari, Neha |
|
dc.contributor.author |
Mekie, Joycee |
|
dc.contributor.other |
International Conference on Electron Devices and Solid-State Circuits (EDSSC) |
|
dc.coverage.spatial |
Hsinchu, TW |
|
dc.date.accessioned |
2018-03-15T06:51:50Z |
|
dc.date.available |
2018-03-15T06:51:50Z |
|
dc.date.issued |
2017-10-18 |
|
dc.identifier.citation |
Kumari, Neha and Mekie, Joycee, "Upset hardened latch as data synchronizer", in the International Conference on Electron Devices and Solid-State Circuits (EDSSC), Hsinchu, TW, Oct. 18-20, 2017. |
en_US |
dc.identifier.uri |
https://repository.iitgn.ac.in/handle/123456789/3510 |
|
dc.description.abstract |
Upset hardened dual-interlocked cell (DICE) [1] has found an important place in circuits for space applications due to its ability to mitigate single event upsets (SEUs). In this paper, we show that DICE latch/flip-flop exhibits better immunity to metastability compared to D flip-flop, and can be used as data synchronizer. Metastablity constant (?), whose inverse captures the ability of the latch to exit from metastable state is about one-half in DICE compared to a similar sized standard latch. This would mean an improvement of 7x in mean-time between failure (MTBF) due to metastability. We have simulated both DICE and D flip-flops designed in different technology nodes-180nm, 130nm, 65nm, and 40nm for planar devices and 20nm, 16nm, 14nm, 10nm and 7nm for FinFET devices along with process variations. We have done pre and post-layout simulations of DICE and D flip-flops taking into account process corners variations. We report that DICE exhibits better metastability hardness compared to D flip-flop across all technology nodes, except at 7nm. We also report that in all the cases ? of DICE flip-flop is lower than that of D flip-flop. |
|
dc.description.statementofresponsibility |
by Neha Kumari, and Joycee Mekie |
|
dc.language.iso |
en |
en_US |
dc.publisher |
IEEE |
en_US |
dc.title |
Upset hardened latch as data synchronizer |
en_US |
dc.type |
Article |
en_US |