| dc.contributor.author |
Gupta, Shubhanshu |
|
| dc.contributor.author |
Mekie, Joycee |
|
| dc.contributor.other |
32nd International Conference on VLSI Design and 2019 18th International Conference on Embedded Systems (VLSID 2019) |
|
| dc.coverage.spatial |
Delhi, IN |
|
| dc.date.accessioned |
2019-06-29T06:04:57Z |
|
| dc.date.available |
2019-06-29T06:04:57Z |
|
| dc.date.issued |
2019-01 |
|
| dc.identifier.citation |
Gupta, Shubhanshu and Mekie, Joycee, "Soft error resilient and energy efficient dual modular TSPC flip-flop", in the 32nd International Conference on VLSI Design and 2019 18th International Conference on Embedded Systems (VLSID 2019), Delhi, IN, Jan. 5-9, 2019. |
en_US |
| dc.identifier.uri |
https://repository.iitgn.ac.in/handle/123456789/4582 |
|
| dc.description.statementofresponsibility |
by Shubhanshu Gupta and Joycee Mekie |
|
| dc.language.iso |
en |
en_US |
| dc.title |
Soft error resilient and energy efficient dual modular TSPC flip-flop |
en_US |
| dc.type |
Article |
en_US |